? semiconductor components industries, llc, 2015 november, 2015 ? rev. p2 1 publication order number: EMI8041/d EMI8041, emi8042, emi8043 product preview common mode filter with esd protection functional description the emi804x is a family of common mode filters (cmf) with integrated esd protection, a first in the industry. dif ferential signaling i/os can now have both common mode filtering and esd protection in one package. the emi804x protects against esd pulses up to 15 kv contact per the iec61000?4?2 standard. the emi804x is well?suited for protecting systems using high?speed dif ferential ports such as usb 3.0, hdmi 1.3/1.4/2.0; corresponding ports in removable storage and other applications. the emi804x is available in a rohs?compliant, xdfn6 for 1 differential pair, xdfn10 for 2 differential pair and xdfn16 package for 3 differential pair. features ? total insertion loss dm loss < 2.5 db at 2.5 ghz ? large differential mode cutoff frequency f 3db > 5 ghz ? high common mode stop band attenuation: 15 db at 700 mhz, 30 db at 2.4 ghz ? low channel resistance 6.0 ? provides esd protection to iec61000?4?2 level 4, 15 kv contact ? these devices are pb?free, halogen free/bfr free and are rohs compliant applications ? usb 3.0 ? hdmi 1.3/1.4/2.0 ? mhl 2.0 ? esata figure 1. EMI8041 electrical schematic this document contains information on a product under development. on semiconductor reserves the right to change or discontinue this product without notice. marking diagrams www. onsemi.com electrical schematics xdfn6 case 711ay emi8042 emi8043 xdfn16 case 711az xx = specific device code m = date code = pb?free package w2 m 1 w3 m xdfn10 case 711ax wa m 1 1 ordering information see detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. 1 udfn6 case 517dg xxxm 1
EMI8041, emi8042, emi8043 www. onsemi.com 2 pin function description pin name device pin type description EMI8041 emi8042 emi8043 in_1+ 1 1 1 i/o cmf channel 1+ to connector (external) in_1? 2 2 2 i/o cmf channel 1? to connector (external) out_1+ 6 10 16 i/o cmf channel 1+ to asic (internal) out_1? 5 9 15 i/o cmf channel 1? to asic (internal) in_2+ na 4 4 i/o cmf channel 2+ to connector (external) in_2? na 5 5 i/o cmf channel 2? to connector (external) out_2+ na 7 13 i/o cmf channel 2+ to asic (internal) out_2? na 6 12 i/o cmf channel 2? to asic (internal) in_3+ na na 7 i/o cmf channel 3+ to connector (external) in_3? na na 8 i/o cmf channel 3? to connector (external) out_3+ na na 10 i/o cmf channel 3+ to asic (internal) out_3? na na 9 i/o cmf channel 3? to asic (internal) v n 3,4 3, 8 3,6,14,11 gnd ground absolute maximum ratings (t a = 25 c unless otherwise noted) parameter symbol value unit operating temperature range t op ?40 to +85 c storage temperature range t stg ?65 to +150 c maximum lead temperature for soldering purposes (1/8? from case for 10 seconds) t l 260 c dc current per line i line 100 ma stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected.
EMI8041, emi8042, emi8043 www. onsemi.com 3 electrical characteristics (t a = 25 c unless otherwise noted) symbol parameter test conditions min typ max unit v rwm reverse working voltage (note 3) 3.3 v v br breakdown voltage i t = 1 ma; (note 4) 4.0 9.0 v i leak channel leakage current t a = 25 c, v in = 3.3 v , gnd = 0 v 1.0 a r ch channel resistance (pins 1?6, 2?5) ? EMI8041 (pins 1?10, 2?9, 4?7 and 5?6) ? emi8042 (pins 1?16, 2?15, 4?13, 5?12, 7?10 and 8?9) ? emi8043 6 .0 dm loss differential mode insertion loss @ 2.5 ghz 2.5 db f 3db differential mode cut - off frequency 50 source and load termination 5.0 ghz f atten common mode stop band attenuation @ 700 mhz 15 db v esd in - system esd withstand voltage a) contact discharge per iec 61000 - 4 - 2 standard, level 4 (external pins) b) contact discharge per iec 61000 - 4 - 2 standard, level 1 (internal pins) (notes 1 and 2) 15 2 kv v cl tlp clamping voltage forward i pp = 8 a forward i pp = 16 a forward i pp = ?8 a forward i pp = ?16 a 7.26 11.8 ?3.5 ?6.7 v product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. 1. standard iec61000?4?2 with c discharge = 150 pf, r discharge = 330, gnd grounded. 2. these measurements performed with no external capacitor . 3. tvs devices are normally selected according to the working peak reverse voltage (v rwm ), which should be equal to or greater than the dc or continuous peak operating voltage level. 4. v br is measured at pulse test current i t .
EMI8041, emi8042, emi8043 www. onsemi.com 4 typical characteristics ?10 ?9 ?8 ?7 ?6 ?5 ?4 ?3 ?2 ?1 0 1.e+06 1.e+07 1.e+09 db (sdd21) frequency (hz) figure 2. typical differential mode attenuation vs. frequency 1.e+06 1.e+08 1.e+09 0 ?5 ?10 ?15 ?20 ?25 ?30 ?35 ?50 frequency (hz) db (scc21) figure 3. typical common mode attenuation vs. frequency 1.e+08 1.e+10 1.e+07 1.e+10 ?40 ?45 m2 m1 m3 interface data rate (gb/s) fundamental frequency (ghz) emi804x insertion loss (db) hdmi 1.3/1.4 3.4 1.7 (m1) m1 = 1.65 m2 = 2.13 m3 = 2.41 usb 3.0 5.0 2.5 (m2) hdmi 2.0 6.0 3.0 (m3)
EMI8041, emi8042, emi8043 www. onsemi.com 5 transmission line pulse (tlp) measurements transmission line pulse (tlp) provides current versus voltage (i?v) curves in which each data point is obtained from a 100 ns long rectangular pulse from a charged transmission line. a simplified schematic of a typical tlp system is shown in figure 4. tlp i?v curves of esd protection devices accurately demonstrate the product?s esd capability because the 10 s of amps current levels and under 100 ns time scale match those of an esd event. this is illustrated in figure 5 where an 8 kv iec61000?4?2 current waveform is compared with tlp current pulses at 8 a and 16 a. a tlp curve shows the voltage at which the device turns on as well as how well the device clamps voltage over a range of current levels. typical tlp i?v curves for the emi804x are shown in figure 4. l sw 50 coax cable 10 mq v c attenuator i m 50 coax cable v m dut oscilloscope figure 4. simplified schematic of a typical tlp system figure 5. comparison between 8 kv iec6100 0 - 4 - 2 and 8 a and 16 a tlp waveforms 18 16 14 12 10 8 6 4 2 0 02 18 16 14 12 46810 i (a) v clamp (v) 0 ?2 ?18 ?14 ?12 ?4 ?6 ?8 ?10 v clamp (v) ?18 i (a) ?16 ?14 ?12 ?10 ?8 ?6 ?4 ?2 0 figure 6. positive and negative tlp waveforms ?16
EMI8041, emi8042, emi8043 www. onsemi.com 6 figure 7. eye diagram test setup for 5gbps data rate pattern generator (5 gbps, prbs31 pattern) 50 ghz sampling oscilloscope onsemi high speed test board (rogers 4003 material, southwest microwave 2.4mm connectors) figure 8. eye diagram 5gbps with and without emi804x eye height (mvppd) rise time (ps) fall time (ps) jrms (ps) jpp (ps) reference (no device)-left figure 724 30.4 29.6 1.997 9.6 emi804x right figure 405 60 60.8 3.484 16 ordering information orderable part number package shipping EMI8041mutag xdfn6 (pb?free) 3000 / tape & reel emi8042mutag xdfn10 (pb?free) 3000 / tape & reel emi8043mutag xdfn16 (pb?free) 3000 / tape & reel EMI8041bmutag udfn6 (pb?free) 3000 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specification s brochure, brd8011/d.
EMI8041, emi8042, emi8043 www. onsemi.com 7 package dimensions udfn6 1.6x1.35, 0.5p case 517dg issue o a b e d bottom view b e 6x 0.10 b 0.05 a c c note 3 2x 0.10 c pin one reference top view 2x 0.10 c a a1 0.08 c 0.10 c c seating plane side view l 3x 1 3 4 6 dim min max millimeters a 0.45 0.55 a1 0.00 0.05 b 0.15 0.25 d 1.60 bsc e 1.35 bsc e 0.50 bsc l2 0.65 0.85 l 0.35 0.55 *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. mounting footprint detail a recommended detail a 6x l2 3x 1.55 0.50 0.56 3x dimensions: millimeters 0.32 1 6x pitch 0.86 3x
EMI8041, emi8042, emi8043 www. onsemi.com 8 package dimensions xdfn6, 1.50x1.35, 0.5p case 711ay issue o ?? ?? dim min max millimeters a a1 0.00 0.05 a3 b 0.15 0.25 d 1.50 bsc e 1.35 bsc e 0.50 bsc notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimensions b applies to plated terminal and is measured between 0.15 and 0.30 mm from terminal tip. 0.15 ref b l pin 1 1 4 3 d e b a c 0.10 c 0.10 2x 2x 6 e 3x 6x note 3 a a1 (a3) seating plane c 0.08 c 0.10 0.40 0.50 l 0.35 0.55 reference top view side view bottom view 0.32 0.86 1.55 0.50 dimensions: millimeters mounting footprint 5x recommended detail a b a c c m 0.10 m 0.05 l1 --- 0.15 detail b 3x 0.51 ?? detail b mold cmpd exposed cu alternate construction 6x c pitch 1 l2 0.65 0.85 l3 0.15 ref l3 l2 3x l1 detail a l alternate constructions l 0.56 3x
EMI8041, emi8042, emi8043 www. onsemi.com 9 package dimensions xdfn10 2.50x1.35, 0.5p case 711ax issue o ??? ??? dim min max millimeters a a1 0.00 0.05 a3 b 0.15 0.25 d 2.50 bsc e 1.35 bsc e 0.50 bsc notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimensions b applies to plated terminal and is measured between 0.15 and 0.30 mm from the terminal tip. 0.15 ref b l pin one 1 6 5 d e b a c 0.10 c 0.10 2x 2x 10 e 10x 10x note 3 a c a1 (a3) seating plane c 0.08 c 0.10 0.40 0.50 l 0.40 0.60 reference top view side view bottom view 0.25 0.65 1.55 0.50 pitch dimensions: millimeters mounting footprint 9x 1 recommended detail a b a c c m 0.10 m 0.05 l1 --- 0.15 detail b 8x 0.47 package outline l1 detail a l alternate constructions l ???
EMI8041, emi8042, emi8043 www. onsemi.com 10 package dimensions xdfn16 4.0x1.35, 0.5p case 711az issue o notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b applies to plated terminal and is measured between 0.15 and 0.30 mm from the terminal tip. a b e d bottom view b e 16x 0.10 b 0.05 a c c note 3 2x 0.10 c pin one reference top view 2x 0.10 c 16x a a1 (a3) 0.08 c 0.10 c c seating plane side view l 16x 1 8 9 16 detail b 0.25 1.55 dimensions: millimeters *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* 1 detail a dim min max millimeters a 0.40 0.50 a1 0.00 0.05 a3 0.15 ref b 0.15 0.25 d 4.00 bsc l 0.40 0.60 e 1.35 bsc e 0.50 bsc l1 ??? 0.15 ??? detail b mold cmpd exposed cu alternate construction l1 detail a l alternate terminal constructions l e/2 0.48 15x 0.50 pitch 0.65 16x recommended l2 l2 0.20 ref on semiconductor and are registered trademarks of semiconductor co mponents industries, llc (scillc). scillc owns the rights to a numb er of patents, trademarks, copyrights, trade secrets, and other inte llectual property. a listing of scillc?s pr oduct/patent coverage may be accessed at ww w.onsemi.com/site/pdf/patent?marking.pdf. scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and s pecifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/ or specifications can and do vary in different applications and actual performance may vary over time. all operating parameters, including ?typical s? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or a uthorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in whic h the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or us e scillc products for any such unintended or unauthorized appli cation, buyer shall indemnify and hold scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unin tended or unauthorized use, even if such claim alleges that scil lc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyrig ht laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 EMI8041/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative
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